Specs:
2 layer, 1.6mm thick
tented vias

Outline/Mechanical Drawing: (3.900"x3.900")
	NP-04.MCH

Layer Order: 
	NP-04.L01 (top component side)
	NP-04.L02 (bottom side)

Green Soldermask:
	NP-04.TSM (top component side)
	NP-04.BSM (bottom side)

Silk Screen:
	NP-04.SLK (component side)

Solder Paste Screen: (0.12mm thickness)
	NP-04.TSP (top component side)

L01-Top side Image (color is copper area)
	NP-04-L01-image.jpg

L01-Bottom side Image (color is copper area)
	NP-04-L02-image.jpg

